Staff SLT Test Engineer
You will lead the development and deployment of System Level Test solutions for next-generation AI processors. You will develop test hardware, software, automation, diagnostics and characterization tools; drive silicon bring-up, yield learning and manufacturing readiness; investigate failures; optimize test strategies; support production ramps; collaborate with engineering and manufacturing teams; and mentor junior engineers.
Responsibilities
- Lead development and deployment of SLT hardware and software solutions
- Own SLT workstreams from requirements definition through production readiness
- Develop and integrate SLT test content with validation, bring-up, product engineering, and manufacturing teams
- Lead development of test boards, sockets, thermal solutions, and instrumentation
- Develop and maintain SLT software frameworks, automation infrastructure, diagnostics, telemetry collection, and data analysis tools
- Drive voltage, frequency, thermal, and reliability characterization
- Lead debugging, failure analysis, root-cause investigations, and correlation activities
- Define and optimize test coverage, test time, screening effectiveness, DPPM, and manufacturing test strategies
- Transfer SLT solutions into OSAT and contract manufacturing environments
- Work with DFT teams on testability, observability, scan architectures, and manufacturing test requirements
- Define future SLT architectures, methodologies, and infrastructure requirements
- Mentor junior engineers and provide technical leadership
- Drive technical reviews, project planning, risk management, and execution tracking
- Collaborate with external vendors and industry partners
Requirements
- Experience in System-Level Test, production test, characterization, or post-silicon validation of complex semiconductor products
- Understanding of semiconductor fundamentals, power delivery, signal integrity, board design practices, and advanced packaging technologies
- Knowledge of DFT methodologies including scan, JTAG, BIST, MBIST, boundary scan, and manufacturing test architectures
- Experience working with OSATs, contract manufacturers, and high-volume manufacturing environments
- Scripting, automation, and debugging skills using Python, Tcl, Shell, Perl, or similar languages
- Ability to lead technical projects and coordinate cross-functional activities
- Communication, collaboration, and problem-solving skills
- Bachelor's degree in electrical engineering, Computer Engineering, or a related field
- Experience with 2.5D/3D stacked semiconductor products is desirable
- Familiarity with chiplets, CoWoS, SoIC, HCB, or other advanced packaging technologies is desirable
Benefits
- Flexible working
- Medical coverage
- Dental coverage
- Vision coverage
- Flexible Spending Accounts
- Health Savings Accounts
- Disability insurance
- Life insurance
- 401(k) retirement plan
- Commuter benefits
- Wellness services
- Employee Assistance Programme